Rated 
(4/5) based on 5 customer reviews
(4/5) based on 5 customer reviews
Description
THERMAL CHARACTERISTICS. Characteristic. Symbol. Max. Unit. Thermal Resistance, Junction-to-Case. R JC. 1.39. C/W. Thermal Resistance, Junction- to- Feb 1, 2006 This change notification covers a change to the epoxy mold compound used for encapsulation of. SOT-93 products assembled by PSI
| Part Number | BDV66C |
| Brand | NXP Semiconductors |
| Image |  |
Lowest Price: $0.73
Highest Price: $2.95
1 - 5 of 5 Record(s)
Part Number
Brand
D/C
Qty
Price (USD)
Company
Part Number:
BDV66C
Brand:
NxpSemiconductors
D/C:
Qty:
935
Price (USD):
0.73
Company:
Cicotex Electronics (HK) Limited
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Part Number:
BDV66C
Brand:
NXP Semiconductor
D/C:
Qty:
5466
Price (USD):
1.285
Company:
Dedicate Electronics (HK) Limited
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Part Number:
BDV66CF
Brand:
WEEN/NXP
D/C:
Qty:
8702
Price (USD):
1.84
Company:
Dedicate Electronics (HK) Limited
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Part Number:
BDV66C
Brand:
NXP/Freescal
D/C:
Qty:
5453
Price (USD):
2.395
Company:
Dedicate Electronics (HK) Limited
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Part Number:
BDV66C
Brand:
NXP
D/C:
Qty:
30000
Price (USD):
2.95
Company:
ZHW High-tech (HK) Co., Limited
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BDV66C Ref.
[hkinnxpsemiconductors20210920][hkinbrandcloudAMpd]
