Description
Mar 23, 2017 Orderable part number Package. Packing method. Minimum order quantity. Temperature. CBTL06DP213EE . CBTL06DP213EE ,118 TFBGA48. CBTL06DP213EE . 6D213. Pb-free (SnAgCu solder compound). TFBGA48 plastic thin fine-pitch ball grid array package;. 48 balls; body 5 5 0.8 mm[1].
Part Number | CBTL06DP213EE |
Brand | NXP Semiconductors |
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CBTL06DP213EE
NXP/Freescal
3282
2.45
HK HEQING ELECTRONICS LIMITED
CBTL06DP213EE
NXP
5000
2.98
SUNTOP SEMICONDUCTOR CO., LIMITED
CBTL06DP213EE
NxpSemiconductors
14520
0.86
Hong Kong Da Lin Tian Yi Electronic Co., Limited
CBTL06DP213EE
NXP Semiconductor
3059
1.39
N&S Electronic Co., Limited
CBTL06DP213EE
WEEN/NXP
18616
1.92
NEW IDEAS INDUSTRIAL CO., LIMITED