Description
Jan 13, 2017 FGY75N60SMD . TP247-3 (G). FSSZ. FSSZ. 5.460355. NA. Terminal. Finish. Base Alloy. Green Status. Reflow Cycles. Max Time at. Temp. Peak. FGY75N60SMD . FGY75N60SMD . TP247-3 (G). Jul 26, 2016. 1.0. FSSZ. 5.460355 g. Each. Manufacturing Process Information. Terminal Finish. Base Alloy. FGY75N60sMd . 600. 75. 1.9. 22. Yes. Power-247. FGH40N65uFd. 650. 40. 1.8. 30. Yes to-247. FGA40N65sMd. 650. 40. 1.9. 13. Yes to-3PN. FGA60N65sMd. Page 1. Topics Covered. Introduction. Balancing mechanisms. Application on TIG welding. Paralleling IR standard speed IGBTs. Full Bridge Inverter.
Part Number | FGY75N60SMD |
Main Category | Discrete Semiconductor Products |
Sub Category | Transistors - IGBTs - Single |
Brand | NXP Semiconductors |
Description | IGBT 600V 150A 750W POWER-247 |
Series | - |
Packaging | Tube |
IGBT Type | Field Stop |
Voltage - Collector Emitter Breakdown (Max) | 600V |
Current - Collector (Ic) (Max) | 150A |
Current - Collector Pulsed (Icm) | 225A |
Vce(on) (Max) @ Vge, Ic | 2.5V @ 15V, 75A |
Power - Max | 750W |
Switching Energy | 2.3mJ (on), 770µJ (off) |
Input Type | Standard |
Gate Charge | 248nC |
Td (on/off) @ 25°C | 24ns/136ns |
Test Condition | 400V, 75A, 3 Ohm, 15V |
Reverse Recovery Time (trr) | 55ns |
Operating Temperature | -55°C ~ 175°C (TJ) |
Mounting Type | Through Hole |
Package / Case | TO-247-3 Exposed Pad |
Supplier Device Package | PowerTO-247-3 |
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