NXP Semiconductors

Description

Jun 24, 2011 DDR3-1066. DDR3-1333. DDR3-1600. DDR3-1866. DDR3-2133. Unit. 7-7-7. 9- 9-9. 11-11-11. 13-13-13. 14-14-14. tCK(min). 1.875. 1.5. 1.25. Dec 19, 2016 (End of Life) with new K4B1G1646I - BCK0 (J37656-001). Intel reports validation completed with passing results. Current DDR3 (G38649-001). K4B1G1646I datasheet. DDR3L SDRAM. Rev. 1.1. Revision History. Revision No . History. Draft Date. Remark. Editor. 1.0. - First Spec. Release. 16th Feb. 2016. Mar 31, 2016 78 Ball -FBGA. Lead Free & Halogen Free, Flip Chip 1600/1866/2133. 7.5x11mm . Now. 128M x 16. K4B1G1646I - BCK0 /MA/NB. 96 Ball -FBGA. Oct 1, 2016 K4B1G1646I . BCK0 /MA/NB. 64Mx16. 96 ball FBGA. K4B1G0846I. BYK0/MA. BMK0/MA. 128Mx8. 1.35V. 78 ball FBGA. MP. K4B1G1646I .