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Description
DATASHEET Mar 26, 2014 LPC1114FN28 /102. DIP28. DIP28: plastic dual in-line package; 28 leads (600 mil). SOT117-1. HVQFN24/33, LQFP48, and TFBGA48 packages. LPC1111FHN33/101. HVQFN33. HVQFN: plastic thermal enhanced very thin Jun 10, 2014 LPC1112FDH20/102, LPC1112FDH28/102, LPC1114FDH28/102, LPC1114FN28 /102. SRAM use by bootloader specified in Section 26.3.1. 8. 20120308. LPC111x/LPC11C1x/LPC11C2x User manual. 7. 20110919. Nov 2, 2011 TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm. SOT361-1. LPC1114FN28 /102. DIP28. DIP28: plastic dual in-line package; 28 leads (600 mil). SOT117-1. HVQFN33 and LQFP48 packages. Sep 26, 2013 Removed LPC1110FD20, LPC1111FDH20, LPC1112FD20, LPC1112FDH20,. LPC1112FDH28, LPC1114FDH28, LPC1114FN28 ; placed in separate errata. ES_LPC1110_11_12_14. 3.2. 20120117. Added ADC.2. 3.1. Mar 5, 2012 LPC1113FHN33, LPC1113FBD48, LPC1114FDH28, LPC1114FN28 ,. LPC1114FHN33, LPC1114FHI33, LPC1114FBD48, LPC1115FBD48,. LPC1100L, LPC1100XL. Abstract. This technical note introduces the features of the
| Part Number | LPC1114FN28 |
| Brand | NXP Semiconductors |
| Image |  |
LPC1114FN28
NxpSemiconductors
5000
1.03
Bostock HK Limited
LPC1114FN28
NXP Semiconductor
1000
1.825
S.E. Components
LPC1114FN28
WEEN/NXP
5855
2.62
Dedicate Electronics (HK) Limited
LPC1110FD20
NXP/Freescal
20
3.415
Yingxinyuan INT'L (Group) Limited
LPC1114FHN33/302
NXP
10
4.21
HONGKONG KUONGSHUN ELECTRONIC LIMITED
