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Description
TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm. SOT570-3. LPC1788FBD144 . LQFP144 plastic low profile quad flat package ; LPC1788FBD144 . 512. 64. 16 X 2. 96. 4. Y. H/O/D. 5. 8-bit. Y. Y. Y. LPC1787FBD208. 512. 64. 16 X 2. 96. 4. N. H/O/D. 5. 32-bit. Y. Y. Y. LPC1786FBD208. 256. Dec 21, 2016 LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm. SOT570-2. LPC1788FBD144 LQFP144. Feb 17, 2015 Info. Content. Keywords. LPC1788FBD208, LPC1788FET208, LPC1788FET180,. LPC1788FBD144 , LPC1787FBD208, LPC1786FBD208,. . . . LPC1788FBD208 LPC1788FET208 LPC1788FET180 LPC1788FBD144 . LPC1787FBD208 LPC1786FBD208 LPC1785FBD208
| Part Number | LPC1788FBD144 |
| Brand | NXP Semiconductors |
| Image |  |
Hot Offer
LPC1788FBD144
NxpSemiconductors
900
0.28
DENO INTERNATIONAL LIMITED
LPC1788FBD144
NXP Semiconductor
20000
0.91
HK Core Group Electronics Limited
LPC1788FBD144
WEEN/NXP
2000
1.54
HONGKONG HUIZHONGDINGTAI ELECTRONIC TECHNOLOGY LIMITED
LPC1788FBD144
NXP/Freescal
9600
2.17
EASYIEE TECHNOLOGY LIMITED
LPC1788FBD144
NXP
10000
2.8
CXS INDUSTRY (HK) CO., LIMITED
