Description
IC MCU ARM ROMLESS 144LQFP Series: LPC18xx Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 83 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40~C ~ 85~C Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)
Part Number | LPC1810FBD144,551 |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - Microcontrollers |
Brand | NXP Semiconductors |
Description | IC MCU 32BIT ROMLESS 144LQFP |
Series | LPC18xx |
Packaging | Tray |
Core Processor | ARM Cortex-M3 |
Core Size | 32-Bit |
Speed | 180MHz |
Connectivity | CAN, EBI/EMI, I²ÂC, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART |
Peripherals | Brown-out Detect/Reset, DMA, I²ÂS, POR, PWM, WDT |
Number of I/O | 83 |
Program Memory Size | - |
Program Memory Type | ROMless |
EEPROM Size | - |
RAM Size | 136K x 8 |
Voltage - Supply (Vcc/Vdd) | 2.2 V ~ 3.6 V |
Data Converters | A/D 8x10b; D/A 1x10b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | 144-LQFP |
Supplier Device Package | 144-LQFP (20x20) |
Image |
LPC1810FBD144,551
NxpSemiconductors
6000
1.23
XZT Electronics (Xinzhongtai Electronics (Hong Kong) Co., Limited)
LPC1810FBD144,551
NXP Semiconductor
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2.1525
HEDEYI ELECTRONIC (HK) CO.,LIMITED
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WEEN/NXP
15000
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Shenzhen Xinderun Electronic Technology Co., Ltd.
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3.9975
CIS Ltd (CHECK IC SOLUTION LIMITED)
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23640
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Mlccbase Manufacturing Ltd