NXP Semiconductors

Description

LPC2478. Single-chip 16-bit/32-bit microcontroller. 6. Pinning information. 6.1 Pinning. Fig 2. LPC2478 pinning LQFP208 package. LPC2478FBD208 . 156. 53. Aug 26, 2009 LPC2478FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm. SOT459-1. LPC2478FET208 TFBGA208 Jul 1, 2012 LPC2470FBD208; LPC2470FET208; LPC2478FBD208 ;. LPC2478FET208, LPC2470/78 errata. Abstract. This errata sheet describes both the Jul 30, 2012 This application note describes the materials for reflow soldering: the Printed- Circuit. Board (PCB), semiconductor packages and solder paste. Features and supported panel types. LCD pins and signals. LCD interface clock settings. Timings. Interfacing to Sharp TFT panels. Other considerations .