NXP Semiconductors

Description

Mar 3, 2014 MF1S5000XDA4 /V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID. SOT500-2. MF1S5000XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID. SOT500-4. May 2, 2011 8 inch wafer, 75 m thickness, on film frame carrier, electronic fail die marking according to SECS-II format), Au bumps, 7-byte UID. -. MF1S5000XDA4 . MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte (120 ) MF1S5031XDUD/V1. (75 ) MF1S5031XDUF/V1. (120 ) MF1S7031XDUD/V1. (75 ) MF1S7031XDUF/V1. MOA4 Module. 7-byte UID. MF1S5000XDA4 /V1. MF1S7000XDA4/V1. 4-byte NUID. MF1S5030XDA4/V1. MF1S7030XDA4/V1. Jun 30, 2014 31-Dec-2014. 30-Jun-2015. MF1S5000XDA4 /V1. J. 935302816118. MF1S5000XDA4 . /V1. MIFARE. Replacement part available. Contact your local NXP sales office. MF1S5000XDA8,118. 935293838118. MF1S5000XDA8. MOA4 Module. MF0MOA4U10/D. MF0MOU2001DA4 (17 pF). MF0MOU2101DA4 (50 pF). 7 B UID MF1S5000XDA4 #. 4 B NUID MF1S5030(X)DA4#. 7 B UID MF1S7000XDA4#. 4 B NUID MF1S7030(X)DA4#. 7 B UID MF1SPLUS6001DA4/ 03.