Description
DATASHEET Dec 4, 2008 ATTENTION: The MRF6V2300N and MRF6V2300NB are high power devices and special considerations must be followed in board design and 1998. 2004. 2006. Year Introduced. F re q u en cy in. M. H z. 3) Cost effective over-molded plastic packaging. MRF6V2300NB Gain & Efficiency vs Output Power. Multi-stage power. ICs. 1. Operation up to 3.8 GHz. . 3. Cost effective over molded plastic packaging. MRF6V2300NB Gain & Efficiency vs Output Power. 22.5.
Part Number | MRF6V2300NB |
Brand | NXP Semiconductors |
Image |
MRF6V2300NB
NxpSemiconductors
5000
1.83
Bostock HK Limited
MRF6V2300NB
NXP Semiconductor
11001
2.6225
Ande Electronics Co., Limited
MRF6V2300NB
WEEN/NXP
5000
3.415
Yestard Electronics Co,.Ltd.
MRF6V2300NB
NXP/Freescal
550
4.2075
S.E. Components
MRF6V2300NB
NXP
343
5
E-CORE COMPONENT CO., LIMITED