NXP Semiconductors

Description

1. 16. SOIC 16 WB. D SUFFIX. CASE 751G. 1. MARKING. DIAGRAMS. 16. 1. SA571D . AWLYYWWG. 16. 1. SA571N. AWLYYWWG. A. = Assembly Location. WL. Jan 19, 2011 MC33030DWG. SA571D . MC33160DW. SA571DG. MC33163DW. SA572D. MC33163DWG. SA572DG. MC33363ADWG. SC14046BDWG. Jul 29, 2005 ON Semiconductor is pleased to announce a quality improvement for 300 mil wide body SOIC packages manufactured at ASE, Chung Li. Jul 31, 2006 Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/ 24/28 lead. Wide body SOIC packages. The devices listed on This is the Final Process Change Notice to IPCN 15621available at www.onsemi. com to notify customers of the capacity expansion of the ON Semiconductor