NXP Semiconductors

Description

SOT223 plastic surface-mounted package with increased heatsink; 4 leads. 8 February 2016. Package information. 1. Package summary. Terminal position SOT-223 . 1. 2. 2. 3. Table 1. Device summary. Order code. Marking. Package. Packaging. STN4NF03L. 4NF03L. SOT-223 . Tape & reel www.st.com SOT-223 Power MOSFET achieves junction-to-case thermal resistance R JC of 12oC/W. 2. Theory. When a device operates in a system under the steady-state Mar 6, 2017 Weight: 0.112 grams (Approximate). Package View. Package Outline Dimensions . SOT223 . SOT223 . Dim Min Max Typ. A. 1.55 1.65 1.60. A1. SOT-223 Case. Mechanical Drawing. Mounting Pad Geometry (Dimensions in mm). Lead Code: Reference individual device datasheet. Part Marking: Full Part