(4/5) based on 12 customer reviews
Description
IC MCU 32BIT 1.5MB FLASH 208BGA Series: MPC55xx Qorivva Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 144 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40～C ~ 125～C Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)
| Part Number | SPC5517EAMMG66 |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - Microcontrollers |
| Brand | NXP Semiconductors |
| Description | IC MCU 32BIT 1.5MB FLASH 208BGA |
| Series | MPC55xx Qorivva |
| Packaging | Tray |
| Core Processor | e200z0, e200z1 |
| Core Size | 32-Bit Dual-Core |
| Speed | 66MHz |
| Connectivity | CAN, EBI/EMI, I²ÂC, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 144 |
| Program Memory Size | 1.5MB (1.5M x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 80K x 8 |
| Voltage - Supply (Vcc/Vdd) | 4.5 V ~ 5.25 V |
| Data Converters | A/D 40x12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package / Case | 208-BGA |
| Supplier Device Package | 208-MAPBGA (17x17) |
| Image |  |
SPC5517EAMMG66
NxpSemiconductors
500
1.82
HK HEQING ELECTRONICS LIMITED
SPC5517EAMMG66
NXP Semiconductor
3000
2.4475
HONG KONG YUE JIN PENG ELECTRONICS CO.
SPC5517EAMMG66
WEEN/NXP
5000
3.075
Bostock HK Limited
SPC5517EAMMG66
NXP/Freescal
15000
3.7025
HK Niuhuasi Technology Limited
SPC5517EAMMG66
NXP
11015
4.33
CIS Ltd (CHECK IC SOLUTION LIMITED)
